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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Intended Uses | Converter, 2.5G, 3G CDMA RF Power Amplifiers | |
| Supply Input Volts | 2.7V ~ 5.5V | |
| Signal Output Quantity | 1 | |
| Delivery Output Volts | 0.3V ~ 5.5V | |
| Ambient Temp Range | -40°C ~ 125°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 10-VFDFN Exposed Pad, 10-MLF® | |
| Vendor Package Type | 10-MLF® (3x3) |
Description
Perfectly designed for situations involving Converter, 2.5G, 3G CDMA RF Power Amplifiers. The input voltage established at 2.7V ~ 5.5V for reliable performance. Mounting configuration Surface Mount for structural stability. Overall outputs 1 for device connections. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Voltage 0.3V ~ 5.5V for optimal output electric potential. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 10-VFDFN Exposed Pad, 10-MLF® that offers mechanical and thermal protection. Type of package 10-MLF® (3x3) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 10-MLF® (3x3) for component selection. Current supply level 2.7V ~ 5.5V for electrical parameters. Input voltage 2.7V ~ 5.5V required for devices. The output voltage 0.3V ~ 5.5V for electrical systems.
