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150 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Intended Uses0

Power Supply Amperage0

Power Supply Voltage0

Ambient Temp Range0

Quality Grade Level0

Certification Qualification0

Attachment Mounting Style0

Component Housing Style0

Vendor Package Type0

Manufacturer

NXP USA INC

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Intended Uses
Power Supply Amperage
Power Supply Voltage
Ambient Temp Range
Quality Grade Level
Certification Qualification
Attachment Mounting Style
Component Housing Style
Vendor Package Type
NXP USA INC
-
-
Tube
Obsolete
Processor
95µA
5.6V ~ 25V
-40°C ~ 105°C
-
-
Through Hole
9-SIP Exposed Tab
9-SIL MPF
NXP USA INC
-
-
Tube
Obsolete
Processor
5µA
9.5V ~ 17.5V
-40°C ~ 85°C
-
-
Through Hole
9-SIP Formed Leads
9-PDBS
NXP USA INC
-
-
Tape & Reel (TR)
Obsolete
OR Controller, UART/USB Data, Audio Management
9µA
2.7V ~ 5.5V
-40°C ~ 85°C
-
-
Surface Mount
20-UFQFN Exposed Pad
20-QFN-EP (3x4)
NXP USA INC
-
-
Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Active
System Basis Chip
84µA
4.5V ~ 28V
-40°C ~ 125°C (TA)
Automotive
AEC-Q100
Surface Mount
32-TSSOP (0.240", 6.10mm Width) Exposed Pad
32-HTSSOP
NXP USA INC
-
-
Tray
Not For New Designs
Wireless Power Transmitter
-
2.7V ~ 5.5V
-40°C ~ 105°C (TA)
Automotive
-
Surface Mount
100-LFBGA
100-MAPBGA (11x11)
NXP USA INC
-
-
Tape & Reel (TR)
Obsolete
Processor
500µA
9.5V ~ 18V
-40°C ~ 85°C
-
-
Surface Mount
20-SOIC (0.433", 11.00mm Width) Exposed Pad
20-HSOP
NXP USA INC
-
-
Tube
Obsolete
Ignition Buffer, Regulator
300µA
9V ~ 18V
-40°C ~ 85°C
-
-
Through Hole
23-SIP Formed Leads
DBS23P
NXP USA INC
-
-
Tube
Obsolete
Processor
500µA
9.5V ~ 18V
-40°C ~ 85°C
-
-
Through Hole
13-SIP Formed Leads
13-PDBS
NXP USA INC
-
-
Tape & Reel (TR)
Obsolete
Handheld/Mobile Devices
-
-
-40°C ~ 85°C
-
-
Surface Mount
247-TFBGA
247-MAPBGA (10x10)
NXP USA INC
-
*
Bulk
Active
-
-
-
-
-
-
-
-
-
NXP USA INC
-
-
Tape & Reel (TR)
Active
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8V ~ 7V
-40°C ~ 105°C
-
-
Surface Mount
40-VFQFN Exposed Pad
40-HVQFN (5x5)
NXP USA INC
-
-
Tube
Obsolete
Telecommunications
2.5mA
4V ~ 12V
0°C ~ 70°C
-
-
Surface Mount
14-SOIC (0.154", 3.90mm Width)
14-SO
NXP USA INC
-
-
Tape & Reel (TR)
Obsolete
Processor
95µA
5.6V ~ 25V
-40°C ~ 85°C
-
-
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SO
NXP USA INC
-
*
Bulk
Active
-
-
-
-
-
-
-
-
-
NXP USA INC
-
-
Tray
Active
System Basis Chip
4.5mA
5.5V ~ 27V
-40°C ~ 85°C
-
-
Surface Mount
32-LQFP
32-LQFP (7x7)
NXP USA INC
-
-
Tube
Obsolete
Processor
95µA
5.6V ~ 25V
-40°C ~ 85°C
-
-
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SO
NXP USA INC
-
-
Tape & Reel (TR)
Obsolete
-
42mA
5.5V ~ 18V
-40°C ~ 125°C
Automotive
-
Surface Mount
28-SOIC (0.295", 7.50mm Width)
28-SOIC
NXP USA INC
-
-
Tape & Reel (TR)Cut Tape (CT)
Obsolete
Contact Monitor
55µA
7V ~ 18V
-40°C ~ 125°C
-
-
Surface Mount
20-SOIC (0.295", 7.50mm Width)
20-SOIC
NXP USA INC
-
-
Bulk
Active
Wireless Power Receiver
120mA
3.5V ~ 20V
-
-
-
Surface Mount
32-UFQFN Exposed Pad
32-QFN (5x5)
NXP USA INC
-
-
Tray
Active
System Basis Chip
40µA
5.5V ~ 40V
-40°C ~ 125°C (TA)
-
-
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
...