Attribute
Description
Manufacturer Part Number
XC7Z030-1FFG676C
Manufacturer
Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
Manufacturer Lead Time
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Stock:

Distributor: 145

Quantity Unit Price Ext. Price
5 ₹ 6,391.18000 ₹ 31,955.90
4 ₹ 7,128.62000 ₹ 28,514.48
3 ₹ 7,374.51000 ₹ 22,123.53
2 ₹ 7,620.30000 ₹ 15,240.60
1 ₹ 7,866.08000 ₹ 7,866.08

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
1 ₹ 33,359.99000 ₹ 33,359.99

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 33,375.00000 ₹ 33,375.00

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 34,157.40000 ₹ 34,157.40

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 35,737.66000 ₹ 35,737.66

Stock:

Distributor: 116


Quantity Unit Price Ext. Price
1 ₹ 36,045.00000 ₹ 36,045.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Zynq®-7000
IC Encapsulation Type Tray
Availability Status Active
System Design Structure MCU, FPGA
Central CPU Unit Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Non-Volatile Flash Memory -
Random Access Memory Bytes 256KB
External Device Support DMA
Interconnect Options CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operational Speed Rating 667MHz
Key Feature Specifications Kintex™-7 FPGA, 125K Logic Cells
Ambient Temp Range 0°C ~ 85°C (TJ)
Quality Grade Level -
Certification Qualification -
Component Housing Style 676-BBGA, FCBGA
Vendor Package Type 676-FCBGA (27x27)

Description

Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ for swift processing. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 676-BBGA, FCBGA that offers mechanical and thermal protection. Type of package 676-FCBGA (27x27) that preserves the integrity of the device. Support for external devices DMA for system integration and improvement. Essential attributes Kintex™-7 FPGA, 125K Logic Cells detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 256KB for system or device specifications. Classification series for the product or component Zynq®-7000. Operational speed 667MHz for mechanical or data tasks. Supplier package type 676-FCBGA (27x27) for component selection.