Attribute
Description
Manufacturer Part Number
M2S050-FGG896
Description
IC SOC CORTEX-M3 166MHZ 896FBGA
Manufacturer Lead Time
34 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 140

Quantity Unit Price Ext. Price
5000 ₹ 6,056.45000 ₹ 3,02,82,250.00
1000 ₹ 6,663.43000 ₹ 66,63,430.00
500 ₹ 11,865.48000 ₹ 59,32,740.00
250 ₹ 12,200.12000 ₹ 30,50,030.00
50 ₹ 12,553.45000 ₹ 6,27,672.50
1 ₹ 12,738.57000 ₹ 12,738.57

Stock:

Distributor: 110


Quantity Unit Price Ext. Price
27 ₹ 10,367.61000 ₹ 2,79,925.47
21 ₹ 10,579.43000 ₹ 2,22,168.03
14 ₹ 15,033.88000 ₹ 2,10,474.32
7 ₹ 28,397.23000 ₹ 1,98,780.61

Stock:

Distributor: 115


Quantity Unit Price Ext. Price
27 ₹ 10,367.61000 ₹ 2,79,925.47
21 ₹ 10,579.43000 ₹ 2,22,168.03
14 ₹ 15,033.88000 ₹ 2,10,474.32
7 ₹ 28,397.23000 ₹ 1,98,780.61

Stock:

Distributor: 116


Quantity Unit Price Ext. Price
216 ₹ 10,826.85000 ₹ 23,38,599.60
162 ₹ 11,104.46000 ₹ 17,98,922.52
108 ₹ 11,396.68000 ₹ 12,30,841.44
54 ₹ 11,704.70000 ₹ 6,32,053.80
27 ₹ 12,373.55000 ₹ 3,34,085.85

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
27 ₹ 12,732.88000 ₹ 3,43,787.76

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
27 ₹ 12,738.57000 ₹ 3,43,941.39

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line SmartFusion®2
IC Encapsulation Type Tray
Availability Status Active
System Design Structure MCU, FPGA
Central CPU Unit ARM® Cortex®-M3
Non-Volatile Flash Memory 256KB
Random Access Memory Bytes 64KB
External Device Support DDR, PCIe, SERDES
Interconnect Options CANbus, Ethernet, I2C, SPI, UART/USART, USB
Operational Speed Rating 166MHz
Key Feature Specifications FPGA - 50K Logic Modules
Ambient Temp Range 0°C ~ 85°C (TJ)
Quality Grade Level -
Certification Qualification -
Component Housing Style 896-BGA
Vendor Package Type 896-FBGA (31x31)

Description

Utilizes a MCU, FPGA architecture to improve effectiveness. Presents connection choices defined by CANbus, Ethernet, I2C, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Indicates flash memory size evaluated at 256KB. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 896-BGA that offers mechanical and thermal protection. Type of package 896-FBGA (31x31) that preserves the integrity of the device. Support for external devices DDR, PCIe, SERDES for system integration and improvement. Essential attributes FPGA - 50K Logic Modules detailing main features. Product status Active concerning availability and lifecycle. The total size of RAM 64KB for system or device specifications. Classification series for the product or component SmartFusion®2. Operational speed 166MHz for mechanical or data tasks. Supplier package type 896-FBGA (31x31) for component selection.