Attribute
Description
Manufacturer Part Number
R9A06G037GNP#AA0
Description
SOC PLC MODEM LSI SMART GRID ASS
Manufacturer Lead Time
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Stock:

Distributor: 145

Quantity Unit Price Ext. Price
100 ₹ 267.36000 ₹ 26,736.00
75 ₹ 298.21000 ₹ 22,365.75
58 ₹ 308.50000 ₹ 17,893.00
42 ₹ 318.78000 ₹ 13,388.76
28 ₹ 329.07000 ₹ 9,213.96
12 ₹ 401.04000 ₹ 4,812.48

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
2500 ₹ 269.68000 ₹ 6,74,200.00
1000 ₹ 277.48000 ₹ 2,77,480.00
500 ₹ 284.88000 ₹ 1,42,440.00
250 ₹ 293.87000 ₹ 73,467.50
100 ₹ 308.78000 ₹ 30,878.00
25 ₹ 340.04000 ₹ 8,501.00
10 ₹ 368.47000 ₹ 3,684.70
1 ₹ 482.16000 ₹ 482.16

Stock:

Distributor: 116


Quantity Unit Price Ext. Price
10 ₹ 277.02000 ₹ 2,770.20
1 ₹ 284.80000 ₹ 284.80

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 637.24000 ₹ 637.24
10 ₹ 478.82000 ₹ 4,788.20
25 ₹ 445.89000 ₹ 11,147.25
100 ₹ 392.49000 ₹ 39,249.00
250 ₹ 372.02000 ₹ 93,005.00
500 ₹ 333.75000 ₹ 1,66,875.00
1000 ₹ 281.24000 ₹ 2,81,240.00
2500 ₹ 269.67000 ₹ 6,74,175.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line RZ/T
IC Encapsulation Type Tray
Availability Status Active
System Design Structure DSP, MCU
Central CPU Unit ARM® Cortex®-M3
Non-Volatile Flash Memory -
Random Access Memory Bytes 128kB
External Device Support PWM
Interconnect Options CSI, I2C, UART
Operational Speed Rating 138MHz
Key Feature Specifications -
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Component Housing Style 64-VFQFN Exposed Pad
Vendor Package Type 64-HVQFN (9x9)

Description

Utilizes a DSP, MCU architecture to improve effectiveness. Presents connection choices defined by CSI, I2C, UART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 64-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 64-HVQFN (9x9) that preserves the integrity of the device. Support for external devices PWM for system integration and improvement. Product status Active concerning availability and lifecycle. The total size of RAM 128kB for system or device specifications. Classification series for the product or component RZ/T. Operational speed 138MHz for mechanical or data tasks. Supplier package type 64-HVQFN (9x9) for component selection.