Description

Utilizes a MCU, MPU architecture to improve effectiveness. Presents connection choices defined by Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-A72, ARM® Cortex®-R5F for swift processing. Evaluated as Automotive grade for quality control. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 433-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 433-FCBGA (17.2x17.2) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Certification AEC-Q100 for compliance with testing or regulatory standards. The total size of RAM 1.5MB for system or device specifications. Operational speed 2GHz, 1GHz for mechanical or data tasks. Supplier package type 433-FCBGA (17.2x17.2) for component selection.