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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Primary Function Mode | Power Line Communication Modem (PLC) | |
| User Interface Type | SPI | |
| Electrical Circuit Count | 1 | |
| Power Supply Voltage | 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V | |
| Power Supply Amperage | - | |
| Wattage Power Level | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 81-TBGA | |
| Vendor Package Type | 81-TFBGA (10x10) |
Description
Engineered with Power Line Communication Modem (PLC) features for versatile component usage. Designed for SPI ease of use and user interaction. Mounting configuration Surface Mount for structural stability. The total number of circuits stands at 1 for electrical or electronic setups. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 81-TBGA that offers mechanical and thermal protection. Type of package 81-TFBGA (10x10) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 81-TFBGA (10x10) for component selection. Voltage requirement 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V for electrical specifications. Voltage supply 1.15V ~ 1.32V, 3V ~ 3.6V, 8V ~ 16V for device operation.
