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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Device Type Classification | Receiver | |
| Communication Standard | LVDS | |
| Transceiver Pair Count | 0/16 | |
| Full/Half Duplex Mode | - | |
| Input Hysteresis Voltage | - | |
| Transfer Speed Mbps | 660Mbps | |
| Power Supply Voltage | 3V ~ 3.6V | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 64-TFSOP (0.240", 6.10mm Width) | |
| Vendor Package Type | 64-TSSOP |
Description
Delivers a data transfer rate measured at 660Mbps for rapid operations. Demonstrates a sampling rate capability indicated as 660Mbps. Mounting configuration Surface Mount for structural stability. Total drivers/receivers 0/16 employed in communication or signaling tasks. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 64-TFSOP (0.240", 6.10mm Width) that offers mechanical and thermal protection. Type of package 64-TSSOP that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Protocol for communication LVDS for control or interaction. Supplier package type 64-TSSOP for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. Type classification Receiver for specifications. Voltage supply 3V ~ 3.6V for device operation.
