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14 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Pin Surface Treatment0

Pin Alloy Composition0

Manufacturer

3M

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Pin Surface Treatment
Pin Alloy Composition
3M
₹5,492.80
927
Box
Active
DIP, 0.3" Row Spacing
16 (2 x 8)
Gold
Copper Alloy
3M
₹3,187.71
923
Bulk
Active
SOIC, 0.15" Body
16 (2 x 8)
Gold
Copper Alloy
3M
₹667.50
923
Tray
Active
DIP, .300"
20 (2 x 10)
-
Copper Alloy
3M
₹3,436.88
923
Box
Active
DIP, .300"
14 (2 x 7)
Gold
Copper Alloy
3M
₹4,443.77
923
Tray
Active
DIP, .300"
20 (2 x 10)
Gold
Copper Alloy
3M
₹3,782.50
923
Tray
Active
DIP, .300"
28 (2 x 14)
Gold
Copper Alloy
3M
-
923
Tray
Obsolete
DIP, .600"
36 (2 x 18)
-
Copper Alloy
3M
₹2,600.58
923
Tray
Active
SOIC, 0.30" Body
24 (2 x 12)
-
Copper Alloy
3M
-
923
Tray
Obsolete
DIP, .900"
64 (2 x 32)
-
Copper Alloy
3M
-
923
Bulk
Active
DIP, .600"
22 (2 x 11)
-
Copper Alloy
3M
-
923
Tray
Obsolete
LCC, .050"
20 (4 x 5)
-
Copper Alloy
3M
-
923
Bulk
Obsolete
DIP with Cable Assembly
16 (2 x 8)
-
Nickel Silver
3M
-
923
Tray
Active
DIP, .600"
48 (2 x 24)
-
Copper Alloy
3M
-
923
Bulk
Active
DIP with Cable Assembly
20 (2 x 10)
-
Nickel Silver