Attribute
Description
Manufacturer Part Number
IW-G50S-OL93-4L002G-E016G-BIA
Manufacturer
Description
I.MX 9352 PICO ITX SBC
Manufacturer Lead Time
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Stock:

Distributor: 117

Quantity Unit Price Ext. Price
1 ₹ 43,572.99000 ₹ 43,572.99

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line i.MX
Availability Status Active
Central CPU Unit ARM® Cortex®-A55
Operational Speed Rating 1.7GHz
Processor Core Number 2
Wattage Power Level -
Thermal Management Method Heat Sink
Package Size Specs 3.937" x 2.835" (99.99mm x 72.00mm)
Device Size Standard Pico-ITX
Expansion Slot Bus Type ADC, CAN, I2C, JTAG, LVDS, MIPI-CSI, MIPI-DSI, PWM, SPI, UART
Installed RAM Volume 2GB/0GB
Memory Bus Interface eMMC, M.2, microSD, NOR-Flash, PCIe, SPI
Display Video Ports LVDS, MIPI CSI, MIPI DSI
Network Ethernet Standard 10/100/1000 Mbps (2), GbE (2), RJ45 (2)
USB Interface Version USB 2.0 (2), USB 2.0 OTG (1)
Serial Port Standards -
Digital Input/Output Pins -
Analog Signal In to Out -
System Monitor Timer No
Included Components -
Ambient Temp Range -40°C ~ 85°C

Description

Utilizes a cooling method identified as Heat Sink. Includes the core processor identified as ARM® Cortex®-A55 for swift processing. Conforms to the Ethernet standard specified at 10/100/1000 Mbps (2), GbE (2), RJ45 (2). Has an expansion slot or bus type specified at ADC, CAN, I2C, JTAG, LVDS, MIPI-CSI, MIPI-DSI, PWM, SPI, UART. Shows a form factor labeled as Pico-ITX. The total number of cores is 2 for processors or cables. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Product status Active concerning availability and lifecycle. The total capacity of the installed RAM 2GB/0GB for optimal computing performance. Classification series for the product or component i.MX. Details on package size 3.937" x 2.835" (99.99mm x 72.00mm) for electrical or mechanical components. Measurement dimensions 3.937" x 2.835" (99.99mm x 72.00mm) for component specifications. Operational speed 1.7GHz for mechanical or data tasks. Connection interface eMMC, M.2, microSD, NOR-Flash, PCIe, SPI for storage integration. Version of USB USB 2.0 (2), USB 2.0 OTG (1) for connectivity. Video interfaces LVDS, MIPI CSI, MIPI DSI for display or graphics output. The timer No used for monitoring the system.