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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | RSN | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Ohm Resistance Value | 10 mOhms | |
| Accuracy Tolerance Percentage | ±0.1% | |
| Wattage Power Level | 0.25W, 1/4W | |
| Material Blend | Metal Element | |
| Temp Drift Factor | ±15ppm/°C | |
| Ambient Temp Range | 30°C ~ 70°C | |
| Key Product Highlights | Current Sense, Flame Proof, Non-Inductive, Pulse Withstanding, Safety | |
| Protective Enclosure Finish | - | |
| Installation Mount Type | Flanges | |
| Package Size Specs | 6.000" L x 1.250" W (152.40mm x 31.75mm) | |
| Maximum Mounted Height | 1.380" (35.05mm) | |
| Wire Lead Configuration | - | |
| Component Housing Style | Rectangular Case | |
| Reliability Failure Metric | - | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
Made from a combination of substances referred to as Metal Element. Equipped with features categorized as Current Sense, Flame Proof, Non-Inductive, Pulse Withstanding, Safety. Maximum installed height of 1.380" (35.05mm) for components affixed to the board. Type of mount Flanges for easy installation. Temperature range 30°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Rectangular Case that offers mechanical and thermal protection. Power measured in watts 0.25W, 1/4W for optimal operation. Product status Active concerning availability and lifecycle. Resistance value 10 mOhms for electrical performance. Classification series for the product or component RSN. Details on package size 6.000" L x 1.250" W (152.40mm x 31.75mm) for electrical or mechanical components. Measurement dimensions 6.000" L x 1.250" W (152.40mm x 31.75mm) for component specifications. The temperature drift factor ±15ppm/°C that guarantees performance consistency. Precision tolerance level ±0.1% in manufacturing processes.
