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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Circuit Configuration Style | Bussed | |
| Ohm Value Specification | 560 | |
| Accuracy Tolerance Percentage | ±5% | |
| Resistor Component Total | 5 | |
| IC Pin Total | 6 | |
| Wattage per Component | 200mW | |
| Temp Drift Factor | ±200ppm/°C | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 6-SIP | |
| Package Size Specs | 0.600" L x 0.098" W (15.24mm x 2.50mm) | |
| Vertical Dimension | 0.200" (5.08mm) |
Description
Assesses resistance at forward current Bussed for LED or diode testing. Employs a circuit variation identified as Bussed. Features a height of 0.200" (5.08mm) for accurate dimensional precision. Mounting configuration Through Hole for structural stability. Overall number of pins 6 for connectors or integrated circuits. Overall total of resistors 5 for circuit design purposes. Style of the enclosure/case 6-SIP that offers mechanical and thermal protection. Energy per unit 200mW for evaluating modular systems. Ohmic resistance value 560 for accurate electrical information. Details on package size 0.600" L x 0.098" W (15.24mm x 2.50mm) for electrical or mechanical components. Measurement dimensions 0.600" L x 0.098" W (15.24mm x 2.50mm) for component specifications. The temperature drift factor ±200ppm/°C that guarantees performance consistency. Precision tolerance level ±5% in manufacturing processes. Maximum Vce(on) at Vge 560 for transistor specifications.
