Attribute
Description
Manufacturer Part Number
TDH35H20R0JE
Manufacturer
Description
RES 20 OHM 5% 35W DPAK
Manufacturer Lead Time
1 week

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TDH35
IC Encapsulation Type Bulk
Availability Status Active
Ohm Resistance Value 20 Ohms
Accuracy Tolerance Percentage ±5%
Wattage Power Level 35W
Material Blend Thick Film
Key Product Highlights Moisture Resistant
Temp Drift Factor ±50ppm/°C
Ambient Temp Range -55°C ~ 175°C
Component Housing Style TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Performance Rating Specs -
Vendor Package Type DPAK
Package Size Specs 0.398" L x 0.339" W (10.10mm x 8.60mm)
Maximum Mounted Height 0.185" (4.70mm)
End Connection Points 2
Reliability Failure Metric -

Description

Made from a combination of substances referred to as Thick Film. Consists of contacts described as 2 for reliable interfacing. Equipped with features categorized as Moisture Resistant. Maximum installed height of 0.185" (4.70mm) for components affixed to the board. Total connection points 2 for optimal termination setup. Temperature range -55°C ~ 175°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case TO-263-3, D2PAK (2 Leads + Tab), TO-263AB that offers mechanical and thermal protection. Type of package DPAK that preserves the integrity of the device. Power measured in watts 35W for optimal operation. Product status Active concerning availability and lifecycle. Resistance value 20 Ohms for electrical performance. Classification series for the product or component TDH35. Details on package size 0.398" L x 0.339" W (10.10mm x 8.60mm) for electrical or mechanical components. Measurement dimensions 0.398" L x 0.339" W (10.10mm x 8.60mm) for component specifications. Supplier package type DPAK for component selection. The temperature drift factor ±50ppm/°C that guarantees performance consistency. Precision tolerance level ±5% in manufacturing processes.