Attribute
Description
Manufacturer Part Number
S4-3R3F1
Description
RES 2W SMD 4525 3.3 OHM 1%
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line S
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Active
Ohm Resistance Value 3.3 Ohms
Accuracy Tolerance Percentage ±1%
Wattage Power Level 2W
Material Blend Wirewound
Key Product Highlights Flame Retardant Coating, Safety
Temp Drift Factor ±50ppm/°C
Ambient Temp Range -55°C ~ 275°C
Component Housing Style 4525 J-Lead
Performance Rating Specs -
Vendor Package Type 4525
Package Size Specs 0.449" L x 0.252" W (11.40mm x 6.40mm)
Maximum Mounted Height 0.197" (5.00mm)
End Connection Points 2
Reliability Failure Metric -

Description

Made from a combination of substances referred to as Wirewound. Consists of contacts described as 2 for reliable interfacing. Equipped with features categorized as Flame Retardant Coating, Safety. Maximum installed height of 0.197" (5.00mm) for components affixed to the board. Total connection points 2 for optimal termination setup. Temperature range -55°C ~ 275°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 4525 J-Lead that offers mechanical and thermal protection. Type of package 4525 that preserves the integrity of the device. Power measured in watts 2W for optimal operation. Product status Active concerning availability and lifecycle. Resistance value 3.3 Ohms for electrical performance. Classification series for the product or component S. Details on package size 0.449" L x 0.252" W (11.40mm x 6.40mm) for electrical or mechanical components. Measurement dimensions 0.449" L x 0.252" W (11.40mm x 6.40mm) for component specifications. Supplier package type 4525 for component selection. The temperature drift factor ±50ppm/°C that guarantees performance consistency. Precision tolerance level ±1% in manufacturing processes.