Attribute
Description
Manufacturer Part Number
3217
Manufacturer
Description
MAKER PASTE LEAD-FREE PROTOTYPIN
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Solder Paste | |
| Material Blend | Bi57Sn42Ag1 (57/42/1) | |
| Circular Measurement | - | |
| Fusion Temperature | 284°F (140°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | - | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Lead Free | |
| Physical Form Factor | Tube, 0.35 oz (10g) | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | - |
Description
Made from a combination of substances referred to as Bi57Sn42Ag1 (57/42/1). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Tube, 0.35 oz (10g). Melting point 284°F (140°C) for thermal and material stability. Type of housing Bulk for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Type classification Solder Paste for specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD