Attribute
Description
Manufacturer Part Number
NC191LT10
Manufacturer
Description
SMOOTH FLOW LOW TEMP SOLDER PAST
Manufacturer Lead Time
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Stock:

Distributor: 117

Quantity Unit Price Ext. Price
1 ₹ 707.23000 ₹ 707.23

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Smooth Flow™
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Solder Paste
Material Blend Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Circular Measurement -
Fusion Temperature 280°F (138°C)
Solder Flux Category No-Clean
AWG Wire Size -
Filter Mesh Design 4
Manufacturing Process Type Lead Free
Physical Form Factor Syringe, 0.35 oz (10g), 5cc
Storage Duration Limit 6 Months
Expiration Start Date Date of Manufacture
Cool Storage Temp Range 37°F ~ 46°F (3°C ~ 8°C)

Description

Made from a combination of substances referred to as Bi57.6Sn42Ag0.4 (57.6/42/0.4). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Syringe, 0.35 oz (10g), 5cc. Melting point 280°F (138°C) for thermal and material stability. Mesh type 4 tailored for specific material or airflow needs. Type of housing Bulk for safeguarding or transporting components. Category of process Lead Free for production or operational relevance. Product status Active concerning availability and lifecycle. Classification series for the product or component Smooth Flow™. Duration of product life 6 Months for durability. Start of the shelf life Date of Manufacture for monitoring storage. Temperature range 37°F ~ 46°F (3°C ~ 8°C) for storage or refrigeration to maintain material integrity. Type classification Solder Paste for specifications.