Attribute
Description
Manufacturer Part Number
386857
Manufacturer
Description
63/37 400 3% .032DIA 20AWG
Manufacturer Lead Time
--

Our team will assist you shortly.

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line C400
IC Encapsulation Type Spool
Availability Status Obsolete
Device Type Classification Wire Solder
Material Blend Sn63Pb37 (63/37)
Circular Measurement 0.032" (0.81mm)
Fusion Temperature 361°F (183°C)
Solder Flux Category No-Clean
AWG Wire Size 20 AWG, 21 SWG
Filter Mesh Design -
Manufacturing Process Type Leaded
Physical Form Factor Spool, 1 lb (454 g)
Storage Duration Limit -
Expiration Start Date -
Cool Storage Temp Range -

Description

Made from a combination of substances referred to as Sn63Pb37 (63/37). Offers diameter noted at 0.032" (0.81mm). Makes use of a flux type referred to as No-Clean. Utilizes a form factor outlined as Spool, 1 lb (454 g). Melting point 361°F (183°C) for thermal and material stability. Type of housing Spool for safeguarding or transporting components. Category of process Leaded for production or operational relevance. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component C400. Type classification Wire Solder for specifications. Size of wire gauge 20 AWG, 21 SWG according to electrical standards.