Attribute
Description
Manufacturer Part Number
OS-S031
Manufacturer
Description
SOLDER NO-CLEAN .031" X 20'
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Wire Solder | |
| Material Blend | Sn63Pb37 (63/37) | |
| Circular Measurement | 0.031" (0.79mm) | |
| Fusion Temperature | 361°F (183°C) | |
| Solder Flux Category | No-Clean | |
| AWG Wire Size | 20 AWG, 22 SWG | |
| Filter Mesh Design | - | |
| Manufacturing Process Type | Leaded | |
| Physical Form Factor | Spool | |
| Storage Duration Limit | - | |
| Expiration Start Date | - | |
| Cool Storage Temp Range | - |
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