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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Plato® | |
| IC Encapsulation Type | Bag | |
| Availability Status | Obsolete | |
| Device Type Classification | Sponge | |
| Overall Size Dimension | 4.49" L x 2.76" W (114.0mm x 70.0mm) | |
| Matching Accessory Items | Soldering Irons, Workstands | |
| Technical Specifications | No Holes |
Description
Designed for related items marked as Soldering Irons, Workstands. Type of housing Bag for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Plato®. Total dimensions 4.49" L x 2.76" W (114.0mm x 70.0mm) for physical characteristics. Information No Holes for detailed product data. Type classification Sponge for specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD