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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | BERTECH® CFT | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Adhesive Tape Category | Copper Foil | |
| Bonding Agent Type | Acrylic | |
| Support Layer Material | Copper Foil | |
| Material Thickness Gauge | 0.0026" (2.6 mils, 0.066mm) | |
| Adhesive Layer Depth | 0.0011" (1.1 mils, 0.028mm) | |
| Carrier Backing Depth | 0.0015" (1.5 mils, 0.038mm) | |
| Horizontal Width Dimension | 0.25" (6.35mm) 1/4" | |
| Linear Length Dimension | 108' (32.9m) 36 yds | |
| Visual Hue | Natural | |
| Intended Usage Scenario | EMI/RFI Shielding | |
| Operating Temp Limits | 155°F (68.3°C) |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD