Product Attributes

Type	Description	Select All
Category	Thermal Tapes Adhesives and Insulating Materials Adhesive Tape Products
Import Duty Classification	-
Product Series Line	CHIPQUIK®
IC Encapsulation Type	Bulk
Availability Status	Active
Adhesive Tape Category	Film
Bonding Agent Type	Silicone
Support Layer Material	Polyimide
Material Thickness Gauge	0.0020" (2.0 mils, 0.051mm)
Adhesive Layer Depth	0.0010" (1.0 mils, 0.025mm)
Carrier Backing Depth	0.0010" (1.0 mils, 0.025mm)
Horizontal Width Dimension	0.38" (9.65mm) 3/8"
Linear Length Dimension	108' (32.9m) 36 yds
Visual Hue	Amber
Intended Usage Scenario	-
Operating Temp Limits	-100°F ~ 500°F (-73°C ~ 260°C)