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165 Results

Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

ASSMANN WSW COMPONENTS

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bulk
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
-
-
-
-
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
₹10.39
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
ASSMANN WSW COMPONENTS
-
-
Bulk
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
-
-
-
-
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
₹166.94
-
Tube
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150.0µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Bag
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
ASSMANN WSW COMPONENTS
-
-
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
...