Manufacturer

3M

Part Number	Manufacturer	Price	Product Series Line	IC Encapsulation Type	Availability Status	Device Type Classification	Grid Pin Array Count	Mating Connector Pitch	Engaging Pin Coating	Engagement Layer Thickness	Connecting Pin Material	Attachment Mounting Style	Key Product Highlights	Circuit End Method	Post Pin Interval	Post-Contact Pin Layer	Post Layer Depth	Solder Tail Material	Casing Build Material	Ambient Temp Range
2256-9308-01-2401 3M	3M	-	Textool™	Bulk	Obsolete	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2256-6321-9UA-1902 3M	3M	-	Textool™	Bulk	Obsolete	PGA, ZIF (ZIP)	256 (21 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C
ICO-163-S8A-T 3M	3M	-	ICO	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
240-1288-00-0602J 3M	3M	₹3,272.30	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
228-7396-55-1902 3M	3M	₹8,373.32	Textool™	Bulk	Active	SOIC	28 (2 x 14)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
8484-11B1-RK-TP 3M	3M	₹145.43	8400	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
220-4842-00-3303 3M	3M	-	OEM	Bulk	Obsolete	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Polyether Imide (PEI), Glass Filled	-55°C ~ 105°C
ICO-203-S8-T 3M	3M	-	ICO	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
8432-21B1-RK-TR 3M	3M	₹100.14	8400	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
242-1293-00-0602J 3M	3M	₹1,438.73	Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
4832-6000-CP 3M	3M	₹47.38	4800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
228-7474-55-1902 3M	3M	₹3,818.99	Textool™	Bulk	Active	SOIC	28 (2 x 14)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
240-4846-00-3303 3M	3M	-	OEM	Bulk	Obsolete	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	250.0µin (6.35µm)	Beryllium Copper	Polyether Imide (PEI), Glass Filled	-55°C ~ 105°C
284-1273-00-1102JH 3M	3M	-	OEM	Bulk	Obsolete	PLCC	84 (4 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
232-1287-00-0602J 3M	3M	₹3,712.96	Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
216-7224-55-1902 3M	3M	₹3,025.23	Textool™	Bulk	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
224-7397-55-1902 3M	3M	₹3,191.78	Textool™	Bulk	Active	SOIC	24 (2 x 12)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
220-7201-55-1902 3M	3M	₹13,226.85	Textool™	Bulk	Active	SOIC	20 (2 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
8444-11B1-RK-TP 3M	3M	₹104.41	8400	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
208-7391-55-1902 3M	3M	₹2,186.23	Textool™	Bulk	Active	SOIC	8 (2 x 4)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C

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