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Manufacturer1

Product Series Line0

IC Encapsulation Type0

Availability Status0

Device Type Classification0

Grid Pin Array Count0

Mating Connector Pitch0

Engaging Pin Coating0

Engagement Layer Thickness0

Connecting Pin Material0

Attachment Mounting Style0

Key Product Highlights0

Circuit End Method0

Post Pin Interval0

Post-Contact Pin Layer0

Post Layer Depth0

Solder Tail Material0

Casing Build Material0

Ambient Temp Range0

Manufacturer

ARIES ELECTRONICS

Part Number
Manufacturer
Price
Product Series Line
IC Encapsulation Type
Availability Status
Device Type Classification
Grid Pin Array Count
Mating Connector Pitch
Engaging Pin Coating
Engagement Layer Thickness
Connecting Pin Material
Attachment Mounting Style
Key Product Highlights
Circuit End Method
Post Pin Interval
Post-Contact Pin Layer
Post Layer Depth
Solder Tail Material
Casing Build Material
Ambient Temp Range
img
25-7XXXX-10 ARIES ELECTRONICS
ARIES ELECTRONICS
-
700 Elevator Strip-Line™
Bulk
Active
SIP
25 (1 x 25)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
img
32-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
img
257-PGM20012-10 ARIES ELECTRONICS
ARIES ELECTRONICS
-
PGM
Bulk
Obsolete
PGA
-
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
img
101-PRS13023-12 ARIES ELECTRONICS
ARIES ELECTRONICS
₹5,823.30
PRS
Bulk
Active
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
img
28-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
28 (4 x 7)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
img
28-6574-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹1,411.90
57
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
img
34-6823-90 ARIES ELECTRONICS
ARIES ELECTRONICS
-
Vertisockets™ 800
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
34 (2 x 17)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
img
40-6518-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹384.01
518
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
03-0518-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹32.72
518
Bulk
Active
SIP
3 (1 x 3)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
44-3553-10 ARIES ELECTRONICS
ARIES ELECTRONICS
-
55
Bulk
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
44 (2 x 22)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
img
84-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
84 (4 x 21)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
img
44-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
44 (4 x 11)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
img
24-6574-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹963.99
57
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
img
196-PRS14001-16 ARIES ELECTRONICS
ARIES ELECTRONICS
-
PRS
Bulk
Obsolete
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Nickel Bronze
50.0µin (1.27µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
img
40-6551-10 ARIES ELECTRONICS
ARIES ELECTRONICS
-
55
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
img
52-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
52 (4 x 13)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
img
40-0518-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹288.62
518
Bulk
Active
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
20-820-90C ARIES ELECTRONICS
ARIES ELECTRONICS
₹853.32
Vertisockets™ 800
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
img
18-3518-10 ARIES ELECTRONICS
ARIES ELECTRONICS
₹139.16
518
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
img
68-536-11 ARIES ELECTRONICS
ARIES ELECTRONICS
-
536
-
Obsolete
PLCC, ZIF (ZIP)
68 (4 x 17)
0.050" (1.27mm)
Gold
12.0µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
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